Printed wiring board and method for manufacturing the same

ABSTRACT

A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is continuation of and claims the benefit ofpriority to U.S. application Ser. No. 13/305,907, filed Nov. 29, 2011,which is a divisional of and claims the benefit of priority to U.S.application Ser. No. 12/606,546, filed Oct. 27, 2009, now U.S. Pat. No.8,686,300, issued Apr. 1, 2014, which is based on and claims the benefitof priority to U.S. Application No. 61/140,746, filed Dec. 24, 2008. Theentire contents of these applications are incorporated herein byreference.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention is related to a printed wiring board having a padformed on the upper-surface side of a resin insulation layer to mount anelectronic component such as a semiconductor element, a conductivecircuit (including an external connection terminal) formed on thelower-surface side of the resin insulation layer to be connected to anexternal substrate, and a via conductor formed in the resin insulationlayer to connect the pad and the external connection terminal. Thepresent invention is also related to a method for manufacturing such aprinted wiring board.

2. Discussion of the Background

Japanese Laid-Open Patent Publication 2000-323613 describes a printedwiring board (multilayer substrate) formed by alternately laminating aresin insulation layer and a conductive layer without using a coresubstrate. In the multilayer substrate of Japanese Laid-Open PatentPublication 2000-323613, pads for a semiconductor element are formed onthe upper-surface side, and pads for external connection terminals areformed on the lower-surface side. The pads for a semiconductor elementare embedded in the outermost insulation layer on the upper-surfaceside. The surfaces of the pads for a semiconductor element are set atthe same level as the outermost-layer surface, or are recessed from theoutermost-layer surface. On the other hand, the pads for externalconnection terminals on the lower-surface side are formed on theoutermost insulation layer at the lower-surface side. The contents ofthis publication are incorporated herein by reference in their entirety.

SUMMARY OF THE INVENTION

According to one aspect of the present invention, a printed wiring boardincludes a resin insulation layer having a first surface and a secondsurface on an opposite side of the first surface, the resin insulationlayer having an opening for a first via conductor, a pad formed on thefirst surface of the resin insulation layer and provided to mount anelectronic component, a first conductive circuit formed on the secondsurface of the resin insulation layer, and a first via conductor formedin the opening and connecting the pad and the first conductive circuit.The pad has an embedded portion embedded in the resin insulation layerand a protruding portion protruding from the resin insulation layer, andthe embedded portion has an external shape which is greater than anexternal shape the protruding portion.

According to another aspect of the present invention, a method formanufacturing a printed wiring board includes forming a pad having aprotruding portion and an embedded portion on a metal film and a platedfilm formed on the metal film, the pad having a coating layer on theprotruding portion, the protruding portion being formed in an openingportion formed in the plated film, the embedded portion being exposedover the plated film, forming on the plated film and the pad a resininsulation layer having a first surface and a second surface on anopposite side of the first surface, the first surface of the resininsulation layer facing the plated film and the pad, removing the metalfilm and the plated film from the first surface of the resin insulationlayer such that the protruding portion of the pad protrudes from thefirst surface of the resin insulation layer, forming in the resininsulation layer an opening for a first via conductor reaching the padfrom the second surface of the resin insulation layer, forming a firstconductive circuit on the second surface of the resin insulation layer,and forming the via conductor in the opening of the resin insulationlayer such that the first conductive circuit and the pad are connected.

BRIEF DESCRIPTION OF THE DRAWINGS

A more complete appreciation of the invention and many of the attendantadvantages thereof will be readily obtained as the same becomes betterunderstood by reference to the following detailed description whenconsidered in connection with the accompanying drawings, wherein:

FIGS. 1A-1G are views showing the steps of a method for manufacturing amultilayer printed wiring board according to the first embodiment of thepresent invention;

FIGS. 2A and 2B are views showing the steps of a method formanufacturing a multilayer printed wiring board according to the firstembodiment;

FIGS. 3A-3C are views showing the steps of a method for manufacturing amultilayer printed wiring board according to the first embodiment;

FIGS. 4A-4C are views showing the steps of a method for manufacturing amultilayer printed wiring board according to the first embodiment;

FIGS. 5A-5C are views showing the steps of a method for manufacturing amultilayer printed wiring board according to the first embodiment;

FIGS. 6A-6C are views showing the steps of a method for manufacturing amultilayer printed wiring board according to the first embodiment;

FIG. 7 is a cross-sectional view showing a multilayer printed wiringboard of the first embodiment;

FIG. 8 is a cross-sectional view showing a state in which an IC chip ismounted on a multilayer printed wiring board of the first embodiment;

FIG. 9 is a cross-sectional view showing a magnified view of a pad inthe multilayer printed wiring board shown in FIG. 7;

FIGS. 10A-10C are views showing the steps of a method for manufacturinga multilayer printed wiring board according to the second embodiment ofthe present invention;

FIGS. 11A-11D are views showing the steps of a method for manufacturinga multilayer printed wiring board according to the third embodiment ofthe present invention;

FIG. 12 is a view to illustrate the second plating resist formed onplated film;

FIG. 13A is a view to illustrate a space formed by the coating layer anda space formed by the second plating resist;

FIG. 13B is a view to illustrate an example in which part of the spaceformed by the second plating resist is filled with plating; and

FIG. 14 is a cross-sectional view showing a magnified view of a pad inmultilayer printed wiring boards of the embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE EMBODIMENTS

The embodiments will now be described with reference to the accompanyingdrawings, wherein like reference numerals designate corresponding oridentical elements throughout the various drawings.

First Embodiment

First, the structure of multilayer printed wiring board 10 according tothe first embodiment of the present invention is described withreference to FIGS. 1-8. FIG. 7 is a cross-sectional view of multilayerprinted wiring board 10. FIG. 8 is a view showing a state in which ICchip 90 is mounted on multilayer printed wiring board 10 shown in FIG.7, and multilayer printed wiring board 10 is loaded on motherboard 94.Multilayer printed wiring board 10 has pads 76 for connection withelectronic component 90 such as an IC chip on the upper-surface side,and pads (external connection terminals) (258P) for connection withmotherboard 94 on the lower-surface side. Pad 76 on the upper-surfaceside is made up of a portion (embedded portion) (76A) embedded in resininsulation layer (outermost resin insulation layer) 50 and of a portion(protruding portion) (76B) protruding from resin insulation layer 50.The side wall of the embedded portion makes contact with the resininsulation layer. On the surfaces (top and side surfaces) of protrudingportion (76B), coating layer 38 is formed. The coating layer ispreferred to be made of plated film. In the first embodiment, thecoating layer is made of tin-plated film. Solder bump 78 is formed onthe coating layer, and the pad is connected to electrode 92 of IC chip90 by means of solder bump 78. If tin-plated film is formed on the padas a coating layer, wettability will be enhanced between the pad and thesolder bump. Meanwhile, on the lower-surface side of the multilayerprinted wiring board, lowermost resin insulation layer 250 is formed. Onthe second surface (the surface where external connection terminals areformed) of the lowermost resin insulation layer, conductive circuits 258including pads (external connection terminals) (258P) are formed. Inlowermost resin insulation layer 250, via conductors 260 are formed. Onthe second surface of lowermost resin insulation layer 250, solderresist layer 70 with openings (70 a) is formed. Portions of conductivecircuits 258 or via conductors 260 exposed through openings (70 a) ofsolder resist layer 70 work as external connection terminals (258P). Themultilayer wiring board is connected to motherboard 94 or pins by meansof solder bumps 79 formed on external connection terminals (258P).

Pads 76 for connection with an IC chip on the upper-surface side andpads (258P) for connection with a motherboard on the lower-surface sideare connected by means of via conductors 60 formed in resin insulationlayer 50 and via conductors 260 formed in resin insulation layer 250.

A magnified view of pad 76 in circle “C” of FIG. 7 is shown in FIG. 9.In multilayer printed wiring board 10 of the first embodiment, pad 76 onthe upper-surface side is made up of a portion (embedded portion) (76A)embedded in resin insulation layer 50 and of a portion (protrudingportion) (76B) protruding from resin insulation layer 50. Pads 76 on theupper-surface side are pads for mounting electronic components such asan IC. In a multilayer printed wiring board according to the firstembodiment, outer diameter (D2) of protruding portion (76B) is smallerthan outer diameter (D1) of embedded portion (76A). A solder bump isformed on the surfaces of the protruding portion and on the top surfaceof the embedded portion. Thus, the surface area of a pad of the firstembodiment is made greater than that of a pad whose surface in contactwith a solder bump is flat. Thus, the connection area will increasebetween pad 76 and solder bump 78. Accordingly, in multilayer printedwiring board 10 of the first embodiment, the bonding strength betweenpad 76 and solder bump 78 increases. As a result, connection reliabilityis enhanced between pad 76 and solder bump 78.

Resin insulation layers 50, 250 forming multilayer printed wiring board10 of the first embodiment are made of resin and inorganic particlessuch as silica. As for inorganic particles other than silica, these maybe listed: alumina, barium sulfate, magnesium oxide or the like.Accordingly, in a printed wiring board of the first embodiment, warpingor undulation may tend to occur. When mounting an electronic componentin such a printed wiring board, the space between an electrode of theelectronic component and a pad may differ in each pad. Thus, themounting productivity of an electronic component or the connectionreliability between the electronic component and the printed wiringboard may tend to decrease. However, in a printed wiring board accordingto the first embodiment, since pad 76 has protruding portion (76B), theheight of solder bump 78 may be raised. As a result, the mountingproductivity or the mounting reliability of an electronic component maybe enhanced in a printed wiring board of the first embodiment. Resininsulation layers in the multilayer printed wiring board of the firstembodiment do not contain core material such as glass fiber or the like,but a resin insulation layer with core material may be used to suppresswarping. Especially, when the number of resin insulation layers is fouror less, it is preferred that a layer be such a resin insulation layermade of inorganic particles, core material and resin. When the number ofresin insulation layers is four or more, it is preferred that all thelayers be such resin insulation layers made of inorganic particles andresin. As for core material, glass cloth, glass non-woven fabric, aramidnon-woven fabric or the like may be used.

In a printed wiring board of the first embodiment, since tin-plated film38 is formed on the surfaces of protruding portion (76B), wettabilitybetween a solder bump and a pad may be improved. It is preferred thatthe coating film be also formed on the embedded portion (on the uppersurface of the embedded portion) left exposed by the protruding portion.In addition, when reflowing a solder bump, tin-plated film 38 fuses intothe solder bump. Accordingly, the connection reliability between a padand solder bump is enhanced. The upper surface of the embedded portion(the part of the embedded portion left exposed by the protrudingportion) which is not covered by the protruding portion is preferred tobe recessed from the first surface of the resin insulation layer (seeFIG. 14). FIG. 14 is a view showing a state in which the coating layeris fused into the solder bump. The bump is formed directly on the pad.Also, such a coating layer may be formed more inexpensively and easilythan forming a coating layer of nickel and gold.

In the following, a method for manufacturing multilayer printed wiringboard 10 described above with reference to FIG. 7 will be described byreferring to FIGS. 1-6.

(1) Metal film 300 with a carrier is prepared (FIG. 1A). The metal filmwith a carrier is formed with carrier (support plate) 30 and metal film26 on the carrier. The metal film is laminated on both surfaces of thecarrier by means of removable layer 24. As for a carrier, glass-fiberreinforced substrates or double-sided copper-clad laminates with athickness in the range of 40 μm to 800 μm may be used. As for a metalfilm, copper foils, nickel foils, aluminum foils or the like with athickness in the range of 3 μm to 50 μm may be used. As for removablelayer 24, the following may be used: metallic removable layers made ofnickel or chrome or the like; organic removable layers made ofcarboxybenzotriazole (CBTA), N′,N′-bis(benzotriazolyl methyl) urea(BTD-U), or 3-amino-1H-1,2,4-triazole (ATA) or the like. The carrier andthe metal film are secured with adhesive (301) (FIG. 1B). On metal film26 of metal film 300 with a carrier, plating resist (first platingresist) 34 is formed (FIG. 1C). Then, on areas of the metal film whereplating resist 34 is not formed (the metal film left exposed by thefirst plating resist), plating resist 36 is formed (thickness: (t1) pμ)(FIG. 1D). Specifically, using metal film 26 as the seed, electrolyticplating is performed to form electrolytic copper, nickel, gold or silverplated film. Plated film 36 is preferred to be made from the same metalas that of metal film 22. It is preferred that the metal film be made ofcopper foil, and that the plated film be electrolytic copper-platedfilm. Then, plating resist 34 is removed (FIG. 1E).

(2) Second plating resist 32 is formed on plated film 36 (FIG. 1F).During that time, the periphery of plated film 36 is preferred to beleft exposed by the second plating resist (see FIG. 12). FIG. 12 is aplan view of the substrate in FIG. 1E seen from above. Peripheralportions (36 b) of the plated film are exposed.

(3) On metal film 26 left exposed by the second plating resist, coatinglayer 38 (thickness: (t2) μm) is formed (FIG. 1G). The relationship of(t2) and (t1) is (t2)(t1). Coating layer 38 is preferred to be made of ametal other than that of plated film 36. Furthermore, coating layer 38is preferred to be made of a metal other than that of metal film 26. Asfor such a coating layer, a metal layer made of electroless platedfilms, electrolytic plated films or sputtered films may be listed. Asfor the metal to form such a coating layer, tin, nickel, gold, silver,palladium, platinum, solder or the like may be listed. Such a coatinglayer may contain two or more metal layers. If a coating layer is formedwith two metal layers, the first metal layer formed on the metal filmmay be tin, solder or gold; and the second metal layer formed on thefirst metal layer may be nickel or palladium. When a coating layer isformed with two metal layers, a combination of tin and nickel, acombination of solder and nickel, or a combination of gold and nickel ispreferred to make first and second metal layers in that order. If acoating layer is formed with three metal layers, the first metal layerformed on the metal film may be tin, solder or gold; the second metallayer formed on the first metal layer may be palladium; and the thirdmetal layer formed on the second metal layer may be nickel. Whenperipheral portions (36 b) of plated film 36 are left exposed by thesecond plating resist, the coating layer is preferred to be formed onthe metal film, the side walls of the plated film and peripheralportions (36 b) of the plated film, which are left exposed by the secondplating resist.

(4) By plating, pads 76 made of plating conductor are formed on thecoating layer (FIG. 2A). As for plating, electrolytic plating andelectroless plating may be used. The plating in the first embodiment iselectrolytic copper plating. Pads are preferred to be made ofelectrolytic copper-plated film. As shown in FIGS. 2A and 13A, a spaceformed by the coating layer is filled using the plating of a pad.Furthermore, part of or the entire space formed by the second platingresist is filled using the plating of a pad. FIG. 2A shows an example inwhich the space formed by the second plating resist is filled withplating; and FIG. 13B shows an example in which part of the space formedby the second plating resist is filled with plating. The bottom surfaceof a pad is preferred to be flat.

(5) Plating resist 32 is removed and pads 76 are exposed (FIG. 2B). Thepad surfaces may be roughened.

(6) Resin film having a first surface and a second surface opposite thefirst surface is prepared.

(7) A resin film is laminated in such a way that the first surface ofthe resin film faces pads 76 and plated film 36. After that, by curingthe resin film, resin insulation layer 50 is formed on pads 76 andplated film 36 (FIG. 3A). The resin insulation layer has a first surfaceand a second surface opposite the first surface. The first surface ofthe resin insulation layer is the surface where pads 76 are formed.Portions of the side walls of pads 76 contact resin insulation layer 50.

(8) Next, using a CO2 laser, openings (50 a) for first via conductorsreaching pads 76 are formed in resin insulation layer 50 (FIG. 3B).Openings (50 a) for first via conductors reaching pads 76 expose thebottom surfaces of the pads.

(9) The surface of resin insulation layer 50, including the inner wallsof openings (50 a), is roughened (not shown in the drawings). Afterthat, a catalyst is applied to the surface of resin insulation layer 50including the inner walls of openings (50 a).

(10) Next, the substrate with the applied catalyst is immersed in anelectroless plating solution, and electroless plated film 52 is formedon the surface of resin insulation layer 50, including the inner wallsof openings (50 a) (FIG. 3C). Electroless copper-plated film orelectroless nickel-plated film may be used as such electroless platedfilm. Electroless copper-plated film is preferred.

(11) Plating resist 54 is formed on the substrate where electrolessplated film 52 is formed (FIG. 4A).

(12) Next, in areas where plating resist 54 is not formed, electrolyticplated film 56 is formed (FIG. 4B). As for such electrolytic platedfilm, electrolytic copper-plated film is preferred.

(13) Furthermore, after plating resist 54 is removed, the electrolessplated film residing between portions of electrolytic plated film isremoved by etching. Accordingly, independent conductive circuits 58 andfirst via conductors 60 are formed (FIG. 4C). Then, surfaces ofconductive circuits 58 and first via conductors 60 are roughened (notshown in the drawings).

(14) By repeating above steps (7)-(13), resin insulation layer (lowerresin insulation layer) 250 having outermost via conductors (second viaconductors) 260 and outermost conductive circuits (second conductivecircuits) 258 are formed (FIG. 5A). Accordingly, intermediate substrate1000 is completed. The first embodiment is a case with two resininsulation layers. Since the number of resin insulation layers is threeor less, the resin insulation layer or the lower resin insulation layeris preferred to contain core material. By further repeating above steps(7)-(13), the substrate is multilayered, and a printed wiring board withthree or more resin insulation layers may be manufactured. If thesubstrate has four or more layers, it is preferred that all the resininsulation layers be resin insulation layers without core material, andbe made of resin and inorganic particles such as silica.

(15) Next, solder resist layer 70 with openings (70 a) is formed on bothsurfaces of the intermediate substrate (FIG. 5B). Portions of theoutermost conductive circuits and outermost via conductors exposedthrough openings (70 a) will become external connection terminals.

(16) Next, protective film (not shown in the drawings) made of nickelfilm and gold film on the nickel film is formed on external connectionterminals. Protective layer 74 is laminated on solder resist layer 70and on the protective film. The edges of the substrate where protectivelayer 74 is formed on intermediate substrate 1000 are cut at lines (X-X)in the drawing (FIG. 5C). Then, intermediate bodies 10 on theupper-surface side and on the lower-surface side are separated from thesupport plate using removable layers 24 (FIG. 6A).

(17) Plated film (electrolytic copper-plated film) 36 and metal film(copper foil) 26 are removed by etching to expose upper portions of pads76 from resin insulation layer 50 (FIG. 6B). Pad 76 is made up of aprotruding portion and an embedded portion; the portion protruding fromthe first surface of resin insulation layer 50 is protruding portion(76B) and the portion embedded in resin insulation layer 50 is embeddedportion (76A). The upper surface of the embedded portion left exposed bythe protruding portion is preferred to be recessed from the surface(first surface) of the resin insulation layer. Short-circuiting mayseldom occur between the bumps on adjacent pads. When conductingetching, coating layer (tin-plated film) 38 on the surface of pad 76made of copper will function as a stopper. The coating layer ispreferred to be formed on the upper and side surfaces of the protrudingportion. Furthermore, the coating layer is preferred to be formed on theupper surface of the embedded portion left exposed by the protrudingportion of the pad. If the side wall of the coating layer, which isformed on the upper surface of the embedded portion, makes contact withthe resin insulation layer, the embedded portion of the pad will beseldom etched. When the plated film and the metal film are made of thesame metal, and the coating layer is made of a metal other than that ofthe plated film, by selecting an etching solution, the plated film andthe metal film may be selectively etched away while the coating layerwill not be actually etched. When the coating layer is made of tin orsolder, and the plated film and metal film are made of copper, anetching solution, brand name A-Process made by Meltex Inc., may be used.When the coating layer is made of copper, and the plated film and metalfilm are made of nickel, an etching solution, brand name NH-1860 seriesmade by Mec Co. Ltd., may be used. When the coating layer is made ofgold, and the plated film and metal film are made of copper, ironchloride or copper chloride may be used for an etching solution. Whenthe coating layer is made of nickel, and the plated film and metal filmare made of copper, an etching solution, brand name Mecbrite VE-7100made by Mec Co., Ltd., may be used.

(18) Then, protective layer 74 is removed. Multilayer printed wiringboard (10 a) is completed. When protective film is not formed on theexternal connection terminals, an OSP for corrosion prevention ispreferred to be applied to external connection terminals (258P) (FIG.6C).

(18) In the following, tin-lead solder paste is printed on the topportions of pads 76 on the upper surface. Then, by conducting a reflowat 200°, solder bumps (solder bodies) are formed on the pads. Amultilayer printed wiring board having solder bumps 78 is manufactured(FIG. 7).

IC chip 90 is mounted by means of solder bumps 78 on the upper surface.Then, the wiring board is mounted on motherboard 94 by means of solderbumps 79 on the lower surface (FIG. 8).

Second Embodiment

A method for manufacturing a multilayer printed wiring board accordingto the second embodiment of the present invention is described withreference to FIG. 10. FIG. 10C is a cross-sectional view of multilayerprinted wiring board 10 of the second embodiment. In the firstembodiment described above with reference to FIG. 7, tin-plated film 38is coated on protruding portion (76B) of upper-surface pad 76, andsolder bump 78 is formed on tin-plated film 38. By contrast, in thesecond embodiment, a coating layer, which is made of nickel-plated film(metal layer) 80 and tin-plated film (metal layer) 38 on the nickelfilm, is formed on pad 76 made of copper plating. By arranging a metallayer of nickel between a pad of copper plating and a metal layer oftin, a tin-copper alloy layer will seldom be formed. In the same manner,by arranging a coating layer containing a metal layer of nickel betweena pad of copper plating and a bump containing tin, a tin-copper alloylayer will seldom be formed. As a result, the bonding strength betweenthe pad and the bump increases.

In a multilayer printed wiring board of the second embodiment, a coatinglayer made of nickel-plated layer 80 and tin-plated film 38 is formed onthe surface of protruding portion (76B) of pad 76. Since the corrosionresistance of nickel is high, connection reliability between a solderbump and the pad is ensured for a longer duration.

A method for manufacturing a multilayer printed wiring board of thesecond example is described. By performing electroless tin plating orelectrolytic tin plating as described in above steps (1)-(3), tin-platedfilm 38 is formed on metal film 26 left exposed by second plating resist32 (FIG. 1G). After that, electrolytic nickel plating or electrolessnickel plating is performed to form nickel-plated film 80 on tin-platedfilm 38 (FIG. 10A). It is preferred that both tin plating and nickelplating be performed as electrolytic plating. The tin-plated film ispreferred to be formed on the side wall of plated film 36 and on the topsurface of plated film 36 which are left exposed by the second platingresist. Tin-plated film 38 is preferred to be coated by nickel-platedfilm 80.

Then, as in the first embodiment described above by referring to FIG.2A, pads are formed by electrolytic plating in the spaces created by thecoating layer and the second plating resist (FIG. 10B). The bottomsurfaces of the pads are preferred to be flat. Since the rest of thesteps are the same as in the first embodiment described with referenceto FIG. 2B and subsequent drawings, their descriptions are omitted here.

Third Embodiment

A multilayer printed wiring board according to the third embodiment ofthe present invention is described with reference to FIG. 11. In thefirst embodiment, solder paste was printed on the pads and reflowed toform solder bumps. By contrast, in the third embodiment, as shown inFIG. 11C, solder-plated film 39 is formed on pads 76 by plating. Then,by reflowing such solder film, solder bumps 78 are formed as shown inFIG. 11D.

A method for manufacturing a multilayer printed wiring board accordingto the Third Embodiment is described. As described in step (2) of thefirst embodiment by referring to FIG. 1F, second plating resist 32 isformed on plated film 36. It is preferred that the periphery of platedfilm 36 be left exposed by the second plating resist. Then, byperforming electroless solder plating or electrolytic solder plating,solder-plated film 39 is formed on metal film 26 (FIG. 11A). It ispreferred that the thickness of the solder-plated film be in the rangeof 10-50 μm, and that the solder-plated film be formed on the metalfilm, the side walls of plated film 36 and the top surface of platedfilm 36, which are left exposed by the second plating resist. If thethickness of the solder-plated film is in the range of 10-50 μm, theheight of the solder bumps will become a proper height for mountingelectronic components such as an IC.

Then, as in the First Embodiment described above by referring to FIG.2A, pads 76 are formed by electrolytic plating in the spaces created bythe solder-plated film 39 and the second plating resist (FIG. 11B). Padsmay be formed on solder-plated film by means of a coating layer insteadof being directly formed on the solder-plated film. For example, anickel-plated film may be formed on the solder-plated film. Thesolder-plated film is formed by means of a coating layer residing on thetop surface of a pad left exposed by a resin insulation layer. A coatinglayer may be formed with a metal layer, but may also be formed withmultiple metal layers. When a coating layer is formed with a tin film,the wettability of the pads and solder is improved. Also, a coatinglayer made of tin film and nickel film may be arranged betweensolder-plated film and pads. When a coating layer is made of nickel filmon the pad and a gold film on the nickel film, the bonding strengthbetween pads and solder bumps increases. Because the rest of the stepsare the same as in the first embodiment described with reference to FIG.2B and subsequent drawings, their detailed descriptions are omittedhere. By reflow, solder-plated film becomes solder bumps. In the thirdembodiment, solder bumps are formed directly on pads. However, if thereis a coating layer made of nickel or the like, solder bumps will beformed on pads by means of the coating layer.

EXAMPLE

In the following, the present invention is further described in detailby referring to an example. However, the present invention is notlimited to the scope of such an example. A method for manufacturingmultilayer printed wiring board 10 of the example is described withreference to FIGS. 1-6.

(1) As the starting material, metal film 300 with a carrier is preparedas follows: On copper-clad laminate (carrier) (20A) formed by laminating35 μm-thick copper foil 22 on both surfaces of insulative substrate 20made of 0.8 mm-thick glass epoxy resin, metal film 26 made of copperfoil is laminated by means of removable layer 24 made of nickel, chromeor the like (FIG. 1A). As shown in FIG. 1B, by applying adhesive 301 onthe edges of metal film 300 with a carrier, the metal film and thecarrier are secured. On copper foil 26 of metal film 300 with a carrier,a commercially available photosensitive dry film is laminated and a maskis placed on the dry film, which is then exposed at 110 mJ/cm² anddeveloped with a 0.8% sodium carbonate solution. Accordingly, platingresist (first plating resist) 34 with a thickness of 25 μm is formed(FIG. 1C). Then, electrolytic plating is performed to form plated film36 made of electrolytic copper-plated film with a thickness of 20 μm inareas where plating resist 34 is not formed (FIG. 1D). Plating resist(34) is removed using a 5% KOH solution (FIG. 1E).

(2) A commercially available photosensitive dry film is laminated onplated film 36 and a mask is placed on the dry film, which is thenexposed at 110 mJ/cm², and developed with a 0.8% sodium carbonatesolution. Accordingly, second plating resist 32 with a thickness of 25μm is formed on plated film 36 (FIG. 1F). As shown in FIGS. 1F and 12,the peripheral portions of plated film 36 are left exposed by secondplating resist 32. FIG. 12 is a plan view seen from the side of thesecond plating resist showing the substrate after the second platingresist is formed.

(3) Using metal film (copper foil) 26 and plated film (electrolyticcopper-plated film) 36 as the seed, electrolytic tin plating isperformed. Accordingly, coating layer 38 made of electrolytic tin-platedfilm with a thickness in the range of 0.1-1.0 μm is formed on the copperfoil, and on the side walls of the electrolytic copper-plated film andon the electrolytic plated film, which are left exposed by the secondplating resist (FIG. 1G).

(4) By performing electrolytic copper plating, pads 76 made ofelectrolytic copper-plated film are formed on coating film 38 (FIG. 2A).As shown in FIG. 2A, the space formed by the coating film (see FIG. 13A)and part of the space formed by the second plating resist (see FIG. 13B)are filled with electrolytic copper-plated film 36, and the bottomsurface of electrolytic plated film 36 is made flat.

(5) Second plating resist 32 is removed by a 5% KOH solution to exposepads 76 (FIG. 2B). The surfaces of the pads are roughened (not shown inthe drawings).

(6) Resin film for resin insulation layer (brand name ABF-45SH, made byAjinomoto) is prepared.

(7) Resin film for resin insulation layer is laminated on pads 76 and onthe metal film using vacuum laminator equipment. The conditions arevacuum degree of 67 Pa, pressure of 0.47 MPa, temperature of 85° C. andpressing time of 60 seconds. After that, by thermosetting at 170° C. for40 minutes, resin insulation layer 50 is formed having a first surfaceand a second surface opposite the first surface (FIG. 3A). The sidewalls of the coating layer and the side walls of the embedded portionsof the pads make contact with resin insulation layer 50. The bottomsurfaces of the embedded portions of pads are also in contact with resininsulation layer 50. A pad has a first surface and a second surface(bottom surface) opposite the first surface, and the first surface ofthe pad is the surface that makes contact with the coating layer.

(8) Next, using a CO₂ gas laser, via openings (50 a) are formed reachingfrom the second-surface side of resin insulation layer 50 to the bottomsof the pads (FIG. 3B).

(9) The substrate with via openings (50 a) is immersed in an 80° C.solution containing permanganic acid at 60 g/l, for 10 minutes to removethe particles residing on the surface of resin insulation layer 50.Accordingly, the surface of resin insulation layer 50 including theinner walls of via openings (50 a) is roughened (not shown in thedrawings).

(10) Next, the substrate with applied catalyst is immersed in anelectroless copper plating solution (Thru-Cup PEA) made by C. Uyemura &Co., Ltd. Accordingly, electroless copper-plated film 52 with athickness in the range of 0.3-3.0 μm is formed on the surface of resininsulation layer 50 including the inner walls of via openings (50 a)(FIG. 3C).

[Electroless Plating Conditions]

solution temperature of 34° C. for 45 minutes

(11) A commercially available photosensitive dry film is laminated onthe substrate where electroless copper-plated film 52 is formed, and amask is placed on the dry film, which is then exposed at 110 mJ/cm² anddeveloped with a 0.8% sodium carbonate solution. Accordingly, platingresist 54 with a thickness of 25 μm is formed (FIG. 4A).

(12) Then, the substrate is cleansed with 50° C. water for degreasing,washed with 25° C. water, and further cleansed with sulfuric acid. Then,electrolytic plating is performed under the following conditions to formelectrolytic copper-plated film 56 with a thickness of 15 μm in areaswhere plating resist 54 is not formed (FIG. 4B).

[Electrolytic Plating Solution]

sulfuric acid 2.24 mol/l copper sulfate 0.26 mol/l additive 19.5 ml/l(Cupracid GL, made by Atotech Japan)[Electrolytic Plating Conditions]

current density 1 A/dm² time 70 minutes temperature 22 ± 2° C.

(13) Plating resist 54 is removed using a 5% KOH solution. After that,the electroless plated film between portions of the electrolyticcopper-plated film is etched away using a mixed solution of sulfuricacid and hydrogen peroxide to form independent conductive circuits 58and via conductors 60 (FIG. 4C). Then, the surfaces of conductivecircuits 58 and via conductors 60 are roughened (not shown in thedrawings).

(14) By repeating above steps (7)-(13), resin insulation layer (lowerresin insulation layer) 250 having via conductors 260 and conductivecircuits 258 is built up (FIG. 5A). Accordingly, intermediate substrate1000 is completed.

(15) Next, commercially available solder-resist composition 70 isapplied 20 μm thick on via conductors 260, conductive circuits 258 andlower resin insulation layer 250. Then, after drying the composition at70° C. for 20 minutes, and at 70° C. for 30 minutes, solder resist filmis formed on via conductors 260, conductive circuits 258 and resininsulation layer 250. After that, by exposing and developing the solderresist film, openings (70 a) are formed in the solder resist film toexpose conductive circuits 258 and via conductors 260. Then, the solderresist film is cured after being heated at 80° C. for an hour, at 100°C. for an hour, at 120° C. for an hour and at 150° C. for three hours.Solder resist layer 70 having openings (70 a) and with a thickness of15-25 μm is formed (FIG. 5B). Such a solder resist layer is formed onboth surfaces of intermediate substrate 1000. Conductive circuits 258and via conductors 260 exposed through openings (70 a) will becomeexternal connection terminals.

(16) Next, protection layer 74 is laminated on solder resist layer 70and external connection terminals. Then, the edges of intermediatesubstrate 1000 are cut at lines “X-X” in the drawing (FIG. 5C). At thattime, the cutting position is inside adhesive 301 formed on the metalfilm with a carrier. After that, intermediate bodies 10 on the upper andlower sides are separated from double-sided copper-clad laminate (20A)using removable layers 24 (FIG. 6A).

(17) Electrolytic copper-plated film 36 and copper foil 26 are removedby etching using brand name Melstrip Cu-3931 made by Meltex Inc., andthe upper portion of pad 76 is exposed from the first surface of resininsulation layer 50 (FIG. 6B). The portion of pad 76 protruding from thefirst surface of resin insulation layer 50 will become protrudingportion (76B), and the portion embedded in resin insulation layer 50will become embedded portion (76A). The upper surface of the embeddedportion is recessed from the surface of the resin insulation layer. Theside surface of the embedded portion and the side surface of the coatinglayer formed on the embedded portion are in contact with resininsulation layer 50. During that time, tin-plated film 38 on the surfaceof pad 76 made of copper works as a stopper. Since the coating layer andthe metal film are made of different metals, and the coating layer andthe plated film are also made of different metals, the metal film andthe plated film may be selectively etched away. Metal film 38 made oftin, which is the coating layer, does not actually dissolve in MelstripCu-3931 (etching solution), while plated film 36 and metal film 26, madeof copper, selectively dissolve in Melstrip Cu-3931 (etching solution).Therefore, etching will stop at the coating layer, and pads covered bythe coating layer will not actually dissolve in the etching solution.

(18) After that, protective layer 74 is removed and an OSP for corrosionprevention is applied on lower-surface side pads (258P) (FIG. 6C).Multilayer printed wiring board (10 a) is completed.

(18) In the following, on upper-surface pads 76, tin-lead solder pasteis printed and reflowed at 200° C. to form solder bumps (solder bodies).Multilayer printed wiring board 10 having solder bumps 78 ismanufactured (FIG. 7). Here, instead of tin-lead solder, tin-antimony ortin-silver solder may also be used. At the same time solder paste isbeing printed on upper-surface pads 76, tin-antimony solder paste may beprinted in openings (70 a) of lower-surface solder resist layer 70 andreflowed at 230° C. to form solder bumps (solder bodies) so that amultilayer printed wiring board having bumps both on the upper and lowersurfaces may be manufactured.

IC chip 90 is mounted by means of upper-surface solder bumps 78, and thewiring board is loaded on daughterboard 94 by means of lower-surfacesolder bumps 79 (FIG. 8).

In the above embodiments, an example is described in which the padstructure of the present invention is applied in a built-up multilayerwiring board without a core substrate. However, the pad structure of thepresent invention may be used in various printed wiring boards.

A printed wiring board according to one aspect of the present inventionincludes the following: a resin insulation layer having a first surface,a second surface opposite the first surface, and an opening for a firstvia conductor; a pad for mounting an electronic component formed on thefirst-surface side of the resin insulation layer; a first conductivecircuit formed on the second-surface side of the resin insulation layer;and a first via conductor formed in the opening for a first viaconductor and connecting the pad and the first conductive circuit. Insuch a printed wiring board, the pad is made up of a portion embedded inthe resin insulation layer and a portion protruding from the resininsulation layer, and the external shape of the embedded portion isgreater than the external shape of the protruding portion.

In an embodiment of the present invention, a pad is made up of a portion(embedded portion) which is embedded in a resin insulation layer and ofa portion (protruding portion) which protrudes from the resin insulationlayer. The external shape of the protruding portion is smaller than theexternal shape of the embedded portion. Thus, the surface area of a padaccording to an embodiment of the present invention is greater than thatof a pad whose upper surface is configured flat. In so being set, theconnection area between a pad and a solder bump increases, raising theconnection strength between the pad and the solder bump. Thus, theconnection reliability between the solder bump and the pad may beenhanced. If a pad has a protruding portion, a solder bump is formedaround the protruding portion as well. Thus, the diameter of the solderbump tends to become larger than that of the pad. Accordingly, the spacebetween the adjacent pads needs to be widened to avoid short-circuitingbetween the adjacent solder bumps. However, since the protruding portionis smaller than the embedded portion in an embodiment of the presentinvention, the solder bump seldom becomes larger than the external shapeof the pad. As a result, pitch between the adjacent pads may be setsmaller. Since a pad has a protruding portion, the height of the solderbump may increase. Thus, the space between the pad and an electrode ofan IC chip to be mounted on the pad will be widened. Accordingly, stressgenerated in an electronic component such as an IC chip and the printedwiring board may be eased at the solder bump. Also, underfill may beeasily filled between the IC chip and the printed wiring board.

Obviously, numerous modifications and variations of the presentinvention are possible in light of the above teachings. It is thereforeto be understood that within the scope of the appended claims, theinvention may be practiced otherwise than as specifically describedherein.

What is claimed is:
 1. A printed wiring board, comprising: an outermostresin insulation layer having a first surface and a second surface on anopposite side with respect to the first surface; and a plurality ofconducting structures formed in the outermost resin insulation layersuch that the plurality of conducting structures is positioned in anelectronic component mounting region of the outermost resin insulationlayer, wherein each of the conducting structures is formed in an openingformed in the outermost resin insulation layer such that each of theconducting structures extends from the first surface to the secondsurface of the outermost resin insulation layer, each of the conductingstructures comprises a pad comprising copper on a first surface side ofthe outermost resin insulation layer, a conductive circuit formed on thesecond surface of the outermost resin insulation layer and a viaconductor connecting the pad and the conductive circuit, the padcomprises an embedded portion embedded in the outermost resin insulationlayer and a protruding portion protruding from the embedded portionbeyond the first surface of the outermost resin insulation layer, theembedded portion has an external shape which is greater than an externalshape of the protruding portion such that the embedded portion has anupper surface recessed from the first surface of the outermost resininsulating layer, and each of the conducting structures comprises aplated-film formed on a surface of the protruding portion and the uppersurface of the embedded portion and has a thickness such that when asolder bump is reflowed on the pad, the plated-film is fused into thesolder bump and the solder bump is formed directly on the pad.
 2. Theprinted wiring board according to claim 1, further comprising: at leastone insulating layer comprising a lower resin insulation layer on whichthe outermost resin insulation layer is formed.
 3. The printed wiringboard according to claim 1, wherein the plated-film comprises asolder-plated film formed on the surface of the protruding portion. 4.The printed wiring board according to claim 1, further comprising: aplurality of solder bumps formed on the plurality of conductingstructures respectively such that each of the solder bumps is formeddirectly on the pad.
 5. The printed wiring board according to claim 1,further comprising: a solder-plated film formed on a surface of theprotruding portion, wherein the opening has a surface diameter on thesecond surface of the outermost resin insulation layer, and the viaconductor has a contacting portion in contact with the pad such that thecontact portion has a contact diameter which is smaller than the surfacediameter of the opening on the second surface.
 6. The printed wiringboard according to claim 1, further comprising: a plurality of solderbumps formed on the plurality of conducting structures respectively suchthat each of the solder bumps is formed directly on the pad, wherein theopening has a surface diameter on the second surface of the outermostresin insulation layer, and the via conductor has a contacting portionin contact with the pad such that the contact portion has a contactdiameter which is smaller than the surface diameter of the opening onthe second surface.
 7. The printed wiring board according to claim 1,wherein the plated-film comprises a solder-plated film formed on thesurface of the protruding portion and the upper surface of the embeddedportion.
 8. The printed wiring board according to claim 7, wherein thesolder-plated film has a side surface formed on the upper surface of theembedded portion and the side surface of the coating layer is in contactwith the outermost resin insulation layer.
 9. The printed wiring boardaccording to claim 1, wherein the protruding portion and the embeddedportion are directly connected.
 10. The printed wiring board accordingto claim 1, wherein the embedded portion is formed in the opening of theoutermost resin insulation layer such that the embedded portion has aside surface in contact with the outermost resin insulation layer. 11.The printed wiring board according to claim 1, further comprising: aplurality of solder bumps formed on the plurality of conductingstructures respectively such that each of the solder bump is formeddirectly on the protruding portion and directly on the upper surface ofthe embedded portion.
 12. The printed wiring board according to claim 1,wherein the embedded portion has an outer diameter which is greater thanan outer diameter of the protruding portion.
 13. The printed wiringboard of claim 1, further comprising: a plurality of resin insulatinglayers on which the outermost resin insulation layer, wherein theplurality of resin insulating layers comprises less than four resininsulating layers, and one of said resin insulating layers comprisescore material.
 14. The printed wiring board of claim 13, wherein thecore material comprises at least one of glass cloth, glass non-wovenfabric and aramid non-woven fabric.
 15. The printed wiring board ofclaim 1, further comprising: a plurality of resin insulating layers onwhich the outermost insulation layer is formed and each of which doesnot include core material.
 16. The printed wiring board of claim 1,wherein the opening has a surface diameter on the second surface of theoutermost resin insulation layer, and the via conductor has a contactingportion in contact with the pad such that the contact portion has acontact diameter which is smaller than the surface diameter of theopening on the second surface.
 17. The printed wiring board of claim 2,wherein the opening has a surface diameter on the second surface of theoutermost resin insulation layer, and the via conductor has a contactingportion in contact with the pad such that the contact portion has acontact diameter which is smaller than the surface diameter of theopening on the second surface.
 18. The printed wiring board of claim 2,wherein the plated-film comprises a solder-plated film formed on thesurface of the protruding portion.
 19. The printed wiring board of claim2, further comprising: a plurality of solder bumps formed on theplurality of conducting structures respectively such that each of thesolder bumps is formed directly on the pad.
 20. The printed wiring boardof claim 1, wherein the embedded portion has an outer diameter which isgreater than an outer diameter of the protruding portion, the openinghas a surface diameter on the second surface of the outermost resininsulation layer, and the via conductor has a contacting portion incontact with the pad such that the contact portion has a contactdiameter which is smaller than the surface diameter of the opening onthe second surface.